FEA method in the 3D thermal simulation of MCM - 文章详情页

作者：

Hu, Xiuzhen (Hu, Xiuzhen.) | Li, Zhiguo (Li, Zhiguo.) | Guo, Chunsheng (Guo, Chunsheng.) | Wu, Yuehua (Wu, Yuehua.) | Liao, Jingning (Liao, Jingning.)

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摘要：

The　reliability　of　multi-chip　module　(MCM),　especially　thermal　reliability,　has　become　one　of　the　keys　to　the　reliability　research　of　electronic　product.　Finite　element　analysis　is　an　important　tool　in　the　thermal　analysis　of　MCM.　A　three　dimensional　thermal　model　of　a　kind　of　MCM　was　built　with　ANSYS　to　calculate　the　temperature　distribution.　By　thermal　simulation　and　thermal　analysis,　we　can　raise　a　project　to　improve　the　temperature　field.

关键词：

Computer simulation Finite element method Multichip modules Reliability Temperature distribution Thermoanalysis

作者机构：

[ 1 ] [Hu, Xiuzhen]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 2 ] [Li, Zhiguo]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 3 ] [Guo, Chunsheng]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 4 ] [Wu, Yuehua]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 5 ] [Liao, Jingning]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China

通讯作者信息：

电子邮件地址：

xz.hu@emails.bjut.edu.cn

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