Progress and research in lead-free composite solder - 文章详情页

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Concept　of　lead-free　composite　solder　was　introduced　in　view　of　lead-free　trend　and　soldering　reliability.　The　developing　situation　of　lead-free　composite　solder　was　indicated.　Research　on　materials　preparation,　microstructure　and　properties　ware　emphasized.　Main　problems　existed　in　present　investigation　was　pointed　out　and　the　development　prospect　was　discussed.

关键词：

Brazing filler metals Creep Electronics packaging Microstructure Research Soldering alloys Wetting

作者机构：

[ 1 ] [Liu, Peng]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 2 ] [Gao, Yuan]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 3 ] [Guo, Fu]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 4 ] [Lei, Yong-Ping]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 5 ] [Xia, Zhi-Dong]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[ 6 ] [Shi, Yao-Wu]College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China

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