In　this　paper,　a　novel　temperature　distribution　measurement　method　for　packaged　integrated　circuit　(IC)　chips　is　proposed,　based　on　field-programmable　gate　array　(FPGA)　embedded　ring　oscillators.　A　temperature　sensing　network　is　established　using　the　programmable　logic　resources　of　the　FPGA.　Smart　thermal　sensors　detect　the　temperature　based　on　the　relationship　between　the　delay　time　and　the　temperature　in　the　ring　oscillators.　An　infrared　image　of　the　chip　is　captured　using　an　infrared　camera　to　verify　the　correctness　of　the　proposed　method.　The　spatial　resolution　of　the　temperature　sensor　network　is　0.13　mm　x　0.28　mm　and　the　measured　temperature　error　varies　by　less　than　2.1　degrees　C.