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Abstract：
This paper introduced a new local electric field shield method, which could overcome the effects of electrostatic force on the MEMS sense film during Si-glass electrostatic bonding processes. By using it, the silicon-glass anodic bonding encapsulation of the MEMS device containing sense film is performed successfully.
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China Mechanical Engineering
ISSN： 1004-132X
Year： 2005
Issue： SUPPL.
Volume： 16
Page： 430-431
Cited Count：
WoS CC Cited Count： 0
SCOPUS Cited Count：
ESI Highly Cited Papers on the List： 0 Unfold All
WanFang Cited Count：
Chinese Cited Count：
30 Days PV： 3
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