收录：
摘要：
This paper introduced a new local electric field shield method, which could overcome the effects of electrostatic force on the MEMS sense film during Si-glass electrostatic bonding processes. By using it, the silicon-glass anodic bonding encapsulation of the MEMS device containing sense film is performed successfully.
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来源 ：
China Mechanical Engineering
ISSN： 1004-132X
年份： 2005
期： SUPPL.
卷： 16
页码： 430-431
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