A　microcapsule-type　latent　curing　agent　is　prepared　by　solvent　evaporation　method　with　diaminodiphenylmethane　(DDM)　as　the　core　material　and　PMMA　as　the　wall　material.　The　chemical　structure,　surface　morphology,　core　content,　and　curing　characteristics　of　as-prepared　microcapsule-type　curing　agent　are　characterized　by　FTIR,　SEM,　TGA,　and　DSC.　The　results　show　that　the　obtained　microcapsules　have　smooth　surface　and　the　core　content　is　about　20　wt　%.　The　one-component　adhesive　consisting　of　DDM-PMMA　microcapsule　and　epoxy　resin　can　be　cured　within　30　min　at　130　degrees　C,　and　the　room　temperature　latent　period　is　more　than　30　days.　In　addition,　the　internal　reasons　influencing　the　core　content　of　microcapsules　are　analyzed　by　comparing　and　analyzing　the　structural　compatibility　of　three　kinds　of　wall　material　PMMA,　PS,　and　polyetherimide　with　DDM.　The　results　show　that　the　core　content　is　affected　by　the　compatibility　of　wall　material　and　core　material.　(c)　2019　Wiley　Periodicals,　Inc.　J.　Appl.　Polym.　Sci.　2019,　136,　47757.