Method of rapidly confirming activation energy and extrapolating life of electronic device - 文章详情页

作者：

收录：

EI Scopus PKU CSCD

摘要：

A　new　method,　temperature　ramp　method　for　rapid　evaluation　of　reliability　of　microelectronic　devices,　is　proposed　and　a　new　model　is　set　up.　Using　the　new　model,　the　microelectronic　device＇s　activation　energy　can　be　worked　and　its　life　can　be　extrapolated.　The　range　of　temperatures　used　in　experiments　is　so　wide　that　different　degradation　modes　can　take　place,　and　the　problem　of　multi-degradation　mechanisms　can　be　studied.

关键词：

Activation energy Degradation Electric currents Electronic equipment Extrapolation Life cycle Temperature

作者机构：

[ 1 ] [Li, Jie]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 2 ] [Guo, Chunsheng]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 3 ] [Mo, Yuwei]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 4 ] [Xie, Xuesong]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 5 ] [Cheng, Yaohai]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
[ 6 ] [Li, Zhiguo]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China

通讯作者信息：

电子邮件地址：

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至