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作者:

Xie, Xue-Song (Xie, Xue-Song.) | Zhang, Xiao-Ling (Zhang, Xiao-Ling.) | Lu, Chang-Zhi (Lu, Chang-Zhi.) | Wu, Li (Wu, Li.) | Yuan, Ying (Yuan, Ying.) | Li, Zhi-Guo (Li, Zhi-Guo.) | Cao, Chun-Hai (Cao, Chun-Hai.)

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摘要:

To obtain ohmic contact to n-GaN with a low contact resistivity, Cr/Au/Ni/Au metallic system that was fabricated in n-GaN materials has been developed. The contact resistivity of ohmic contact was tested and analyzed at different temperatures. The contact resistivity of Cr/Au/Ni/Au is about 0.32 mΩ·cm2 at room temperature. With the increasing of temperature, the contact resistivity of Cr/Au/Ni/Au increases a little. At 300°C, its contact resistivity is 0.65 mΩ·cm2. The ohmic contact is suitably used at high temperature.

关键词:

Aluminum Current voltage characteristics Gold Nickel Ohmic contacts Semiconducting gallium compounds Semiconductor growth Titanium

作者机构:

  • [ 1 ] [Xie, Xue-Song]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 2 ] [Zhang, Xiao-Ling]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 3 ] [Lu, Chang-Zhi]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 4 ] [Wu, Li]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 5 ] [Yuan, Ying]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 6 ] [Li, Zhi-Guo]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 7 ] [Cao, Chun-Hai]Nanjing Solid-state Devices Institute, Nanjing 210016, China

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来源 :

Journal of Beijing University of Technology

ISSN: 0254-0037

年份: 2005

期: 5

卷: 31

页码: 449-451

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