Solder Joint Structure of Sn-58Bi Solder Paste with Epoxy-based Flux - 文章详情页

作者：

Li, Qingyang (Li, Qingyang.) | Yang, Xiaojun (Yang, Xiaojun.) | Li, Chengfei (Li, Chengfei.)

收录：

CPCI-S EI

摘要：

Non-clean　soldering　technology　and　low　temperature　bonding　will　be　of　great　significant　for　applications　in　electronic　industry.　A　curable　solder　paste　containing　epoxy-based　flux　and　Sn-58Bi　solder　powder　was　developed.　The　solder　joint　covered　by　cured　epoxy　shell　can　be　obtained　by　soldering　process.　The　thermal-curing　process　of　the　curable　flux　was　monitored　by　DSC　to　ensure　the　wetting　and　metallurgical　connection　between　Sn-58Bi　and　Cu　substrate.　The　microstructure　characteristics　of　the　solder　joints　were　analyzed　by　metallurgical　analysis　and　SEM　observation.　The　factors　influencing　the　structure　of　the　solder　joints　were　analyzed　and　discussed.　©　Published　under　licence　by　IOP　Publishing　Ltd.

关键词：

Binary alloys Bismuth alloys Bismuth metallography Bismuth metallurgy Copper metallography Copper metallurgy Curing Electronics industry Lead-free solders Low temperature operations Soldering Temperature Tin alloys Tin metallography Tin metallurgy

作者机构：

[ 1 ] [Li, Qingyang]College of Material Science and Engineering, Beijing University of Technology, Beijing, China
[ 2 ] [Yang, Xiaojun]College of Material Science and Engineering, Beijing University of Technology, Beijing, China
[ 3 ] [Li, Chengfei]College of Material Science and Engineering, Beijing University of Technology, Beijing, China

通讯作者信息：

[yang, xiaojun]college of material science and engineering, beijing university of technology, beijing, china

电子邮件地址：

yangxj@bjut.edu.cn

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