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作者:

Song, Xubo (Song, Xubo.) | Zhang, Lisen (Zhang, Lisen.) | Liang, Shixiong (Liang, Shixiong.) | Tan, Xin (Tan, Xin.) | Zhang, Zhirong (Zhang, Zhirong.) | Gao, Nan (Gao, Nan.) | Zhang, Yamin (Zhang, Yamin.) | Lv, Yuanjie (Lv, Yuanjie.) | Feng, Zhihong (Feng, Zhihong.)

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EI Scopus

摘要:

GaN Schottky diodes exhibit great potential for high power THz frequency multipliers. This paper presents thermal characterization results of GaN Schottky diodes in the frequency multipliers with flip-chip configuration. Common models of the different Schottky diode multiplier chip layouts are analyzed with 3-D thermal simulators. The thermal resistance results show that the GaN Schottky diodes chips have evident advantage in thermal management compared with GaAs chips. The differences of n -anode Schottky diodes chips in thermal effect are investigated in detail. The impacts of solders and filter substrate on thermal resistance are shown, which indicate the the filter substrate with high thermal conductivity will improve the performance of the THz frequency multipliers obviously. © 2019 IEEE.

关键词:

Diodes Frequency multiplying circuits Gallium arsenide Gallium nitride III-V semiconductors Schottky barrier diodes Thermal conductivity Thermoanalysis

作者机构:

  • [ 1 ] [Song, Xubo]National Key Laboratory of ASIC, Hebei Semiconductor Research Institude, Shijiazhuang, China
  • [ 2 ] [Zhang, Lisen]National Key Laboratory of ASIC, Hebei Semiconductor Research Institude, Shijiazhuang, China
  • [ 3 ] [Liang, Shixiong]National Key Laboratory of ASIC, Hebei Semiconductor Research Institude, Shijiazhuang, China
  • [ 4 ] [Tan, Xin]National Key Laboratory of ASIC, Hebei Semiconductor Research Institude, Shijiazhuang, China
  • [ 5 ] [Zhang, Zhirong]National Key Laboratory of ASIC, Hebei Semiconductor Research Institude, Shijiazhuang, China
  • [ 6 ] [Gao, Nan]National Key Laboratory of ASIC, Hebei Semiconductor Research Institude, Shijiazhuang, China
  • [ 7 ] [Zhang, Yamin]Laboratory of Semiconductor Device Reliability Physics, Beijing University of Technology, Beijing, China
  • [ 8 ] [Lv, Yuanjie]National Key Laboratory of ASIC, Hebei Semiconductor Research Institude, Shijiazhuang, China
  • [ 9 ] [Feng, Zhihong]National Key Laboratory of ASIC, Hebei Semiconductor Research Institude, Shijiazhuang, China

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来源 :

年份: 2019

语种: 英文

被引次数:

WoS核心集被引频次: 0

SCOPUS被引频次: 3

ESI高被引论文在榜: 0 展开所有

万方被引频次:

中文被引频次:

近30日浏览量: 2

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