Temperature distribution measurement for chips based on FPGA - 文章详情页

作者：

Yu, Wen-Juan (Yu, Wen-Juan.) | Feng, Shi-Wei (Feng, Shi-Wei.) (学者：冯士维) | Pan, Shi-Jie (Pan, Shi-Jie.) | Zhang, Ya-Min (Zhang, Ya-Min.) | Shi, Bang-Bing (Shi, Bang-Bing.)

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摘要：

In　this　paper,　a　novel　temperature　distribution　measurement　method　based　on　the　field-programmable　gate　array　(FPGA)　embedded　ring　oscillators　is　proposed.　Ring　oscillators,　as　smart　thermal　sensors,　are　mainly　based　on　the　relationship　between　the　delay　time　and　the　temperature.　An　infrared　image　of　the　chip　is　captured　using　an　infrared　camera　to　verify　the　correctness　of　the　proposed　method.　The　measured　temperature　error　varies　by　less　than　2.1°C.　©　2018　IEEE.

关键词：

Field programmable gate arrays (FPGA) Infrared imaging Integrated circuits Temperature distribution

作者机构：

[ 1 ] [Yu, Wen-Juan]Faculty of Information Technology, Beijing University of Technology, Beijing, China
[ 2 ] [Feng, Shi-Wei]Faculty of Information Technology, Beijing University of Technology, Beijing, China
[ 3 ] [Pan, Shi-Jie]Faculty of Information Technology, Beijing University of Technology, Beijing, China
[ 4 ] [Zhang, Ya-Min]Faculty of Information Technology, Beijing University of Technology, Beijing, China
[ 5 ] [Shi, Bang-Bing]Faculty of Information Technology, Beijing University of Technology, Beijing, China

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