The　microstructure　and　crystal　orientation　of　Ni-5　at　%　W　(Ni5W)　long　tapes　during　recovery　and　recrystallization　processes　under　various　tensile　stresses　are　studied　systematically　by　using　a　tensile　stress　annealing　equipment　designed　in　our　University.　Comparing　these　two　processes　with　and　without　tensile　stresses,　it　is　found　that　tensile　stresses　can　promote　recrystallization,　for　example:　the　cube　orientation　fractions　under　a　tensile　stress　of　20　MPa　is　twice　as　high　as　without　tensile　stress　at　650　degrees　C.　In　the　complete　recrystallization　process,　tensile　stresses　below　10　MPa　have　little　effect　on　the　microstructure　and　crystal　orientation.　When　the　tensile　stress　is　increased　to　25　MPa,　the　grain　boundary　grooves　are　obviously　deepened　into　cracks,　while　the　fractions　of　both　low　angle　grain　boundaries　and　cube　texture　decreased.　This　is　in　contrast　to　an　increase　of　the　fractions　of　sigma　3　twin　boundaries　showing　a　more　abnormal　grain　growth.　The　effects　of　tensile　stresses　on　the　annealing　process　of　Ni5W　long　tapes　are　investigated　experimentally.　They　are　expected　to　guide　the　reel-to-reel　dynamic　recrystallization　annealing　of　Ni5W　long　tapes　and　to　promote　the　transition　from　laboratory　to　industrialization.