Thermal conductivity of epoxy resin using molecular dynamics simulation - 文章详情页

作者：

Pi, Bensong (Pi, Bensong.) | Yu, Huiping (Yu, Huiping.) | Qin, Fei (Qin, Fei.) (学者：秦飞) | Chen, Pei (Chen, Pei.) | Cai, Anwen (Cai, Anwen.)

收录：

EI Scopus

摘要：

The　low　thermal　conductivity　of　amorphous　epoxy　resin　significantly　limits　its　applications　in　electronics.　In　this　paper,　the　thermal　conductivity　of　cross-linked　epoxy　resin　was　investigated　by　Green-Kubo　method.　A　stepwise　crosslinking　method　was　adopted　to　construct　the　molecular　model.　In　order　to　verify　the　correlation　lengths　effect,　four　different　correlation　lengths　are　considered　under　the　same　integral　time.　The　contributions　of　curing　agent　types　and　conversions　towards　thermal　conductivity　are　discussed.　©　2018　IEEE.

关键词：

Electronics packaging Epoxy resins Molecular dynamics Thermal conductivity

作者机构：

[ 1 ] [Pi, Bensong]Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China
[ 2 ] [Yu, Huiping]Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China
[ 3 ] [Qin, Fei]Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China
[ 4 ] [Chen, Pei]Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China
[ 5 ] [Cai, Anwen]Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, China

通讯作者信息：

[yu, huiping]institute of electronics packaging technology and reliability, beijing university of technology, beijing, china

电子邮件地址：

yuhuiping@bjut.edu.cn

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