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作者:

Ye, Lezhi (Ye, Lezhi.) | Wang, Hongtao (Wang, Hongtao.) | Wang, Haiming (Wang, Haiming.) | Li, Desheng (Li, Desheng.) (学者:李德胜)

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摘要:

In the point-to-point high-speed positioning process of the IC packaging mechanism, the nonlinear characteristics of the servo system influence the performance of the servo system to a different extent, which may easily cause resonance of the system and reduce die attach efficiency of the packaging equipment. Based on the above problems, this paper proposes a cross-global artificial bee PID algorithm to suppress mechanical resonance at the load end. Firstly, the reasons of resonance formation and the influence on the servo system are analyzed. Secondly, the modal of the swing arm mechanism in the IC packaging mechanism is analyzed. Finally, the experimental platform is built. The results show that the resonance of the load end is effectively controlled and the positioning efficiency is improved by 9.1%. © 2018 IEEE.

关键词:

Resonance Integrated circuits Timing circuits Electronics packaging Servomechanisms Efficiency Modal analysis Packaging

作者机构:

  • [ 1 ] [Ye, Lezhi]Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Wang, Hongtao]Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Wang, Haiming]CETC Beijing Electronic Equipment Co., Ltd, Beijing; 100176, China
  • [ 4 ] [Li, Desheng]Beijing University of Technology, Beijing; 100124, China

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年份: 2018

页码: 100-103

语种: 英文

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