The　variations　of　the　electrical　parameters　of　semiconductor　devices　with　changes　in　temperature　are　important　for　industrial　and　other　applications　of　these　devices.　Calibrations　of　both　the　linear　relationships　of　device　parameters　with　temperature　in　thermo-sensitive　electrical　parameters　testing　and　the　nonlinear　properties　of　other　device　parameters　with　temperature　are　very　time-consuming　processes　when　using　the　traditional　oven　methods.　In　this　work,　we　proposed　a　method　that　uses　a　linear　temperature　ramping　plate.　The　device　under　test　was　placed　on　this　plate　and　the　device　temperature,　physical　parameters　and　the　time　(t)　were　recorded　at　0.2-s　intervals.　The　curve　of　the　parameter　variations　with　temperature　was　recorded　dynamically　over　a　period　of　350　s　as　the　temperature　ranged　from　20°C　to　120°C.　Comparison　with　the　traditional　static　oven　method　showed　very　good　agreement　between　the　results　obtained　using　the　two　methods,　but　the　time　required　for　the　proposed　method　was　reduced　dramatically.　©　2017　IEEE.