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In the electronic manufacturing industry, solder paste plays a more and more important role, and its performance directly affect the quality of the electronic products. The performance of the low silver lead-free solder paste which is developed in the lab is degenerate during the storage. The viscosity gets increasing, the surface becomes little dry, and printing performance would decline. Meanwhile, wettability and stability are also falling. In this paper, we study the mechanism of the performance degeneration through exploring the stability and solubility of the organic acid surfactant in the existing solvent system. In addition, we also study the function of common corrosion inhibitor. Research results show that in the existing solvent system, the solubility of succinic acid is 4.49%, and the solubility of adipic acid is 3.95%. Compared with triethanolamine, benzene and three azole nitrogen (BTA) has better corrosion resistant performance. © 2017 IEEE.
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Year: 2017
Page: 89-93
Language: English
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ESI Highly Cited Papers on the List: 0 Unfold All
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30 Days PV: 5