A memory-logic separated 3D chip physical design method - 文章详情页

作者：

Shier, Zhang (Shier, Zhang.) | Ligang, Hou (Ligang, Hou.) | Tongyang, Ye (Tongyang, Ye.) | Jinhui, Wang (Jinhui, Wang.) | Xiaohong, Peng (Xiaohong, Peng.)

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EI Scopus

摘要：

3D　IC　is　developing　rapidly,　but　there　is　no　mature　physical　design.　A　3D　chip　physical　design　method　contains　hierarchical　process,　memory　and　TSV　localization　process,　as　well　as　hierarchical　physical　design　process　is　proposed　in　this　paper.　By　splitting　the　netlist,　memory　and　logic　are　layered　up　and　down.　And　the　upper　memories　and　TSV　cells　are　placed　automatically　by　implemented　the　localization　algorithm.　Each　layer　can　be　routed　separately.　It　is　concluded　that　this　physical　design　method　is　feasible　and　the　processes　can　be　compatible　in　2D　EDA　tools.　©　2017　IEEE.

关键词：

Computer circuits Design Three dimensional integrated circuits

作者机构：

[ 1 ] [Shier, Zhang]VLSI and System Lab, Beijing University of Technology, Beijing; 100124, China
[ 2 ] [Ligang, Hou]VLSI and System Lab, Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Tongyang, Ye]VLSI and System Lab, Beijing University of Technology, Beijing; 100124, China
[ 4 ] [Jinhui, Wang]Department of Electrical and Computer Engineering, North Dakota State University, ND; 58102, United States
[ 5 ] [Xiaohong, Peng]VLSI and System Lab, Beijing University of Technology, Beijing; 100124, China

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