TSV modelling in 3D IC thermoelectric simulation - 文章详情页

作者：

Ye, Tongyang (Ye, Tongyang.) | Hou, Ligang (Hou, Ligang.) | Zhang, Shier (Zhang, Shier.) | Wang, Jinhui (Wang, Jinhui.) | Peng, Xiaohong (Peng, Xiaohong.)

收录：

EI Scopus

摘要：

In　three-dimensional　integrated　circuit,　model＇s　establishment　can　help　us　to　design　the　chip　and　analyze　its　performance　effectively.　In　previous　studies,　most　modelling　was　based　on　a　single　physical　field,　which　could　not　completely　simulate　the　actual　working　environment　of　the　chip.　In　this　paper,　we　establish　a　TSV　model　in　3D　IC　thermoelectric　simulation.　Modelling　is　based　on　the　multi　physical　field　coupling　and　uses　COMSOL　software　to　create　a　more　realistic　work　scenario　for　the　chip.　By　establishing　the　model　and　setting　the　boundary　conditions,　we　studied　the　thermal　distribution　and　electrical　distribution　of　the　chip.　Finally　we　discussed　several　factors　influencing　the　thermal　distribution　of　the　chip.　©　2017　IEEE.

关键词：

3D modeling Models Three dimensional integrated circuits Timing circuits

作者机构：

[ 1 ] [Ye, Tongyang]VLSI and System Lab, Beijing University of Technology, Beijing; 100124, China
[ 2 ] [Hou, Ligang]VLSI and System Lab, Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Zhang, Shier]VLSI and System Lab, Beijing University of Technology, Beijing; 100124, China
[ 4 ] [Wang, Jinhui]Department of Electrical and Computer Engineering, North Dakota State University, Fargo; ND; 58102, United States
[ 5 ] [Peng, Xiaohong]VLSI and System Lab, Beijing University of Technology, Beijing; 100124, China

通讯作者信息：

[hou, ligang]vlsi and system lab, beijing university of technology, beijing; 100124, china

电子邮件地址：

houligang@bjut.edu.cn

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