Vibration　reliability　test　for　plastic　ball　grid　array　solder　joints　have　been　developed　by　performing　vibration　tests　with　constant　G-level　input　excitation.　A　specially　designed　PBGA　assembly　with　built-in　daisy　chain　circuits　was　mounted　on　a　printed　circuit　board　as　the　test　vehicle.　The　test　vehicle　was　mounted　on　vibration　shaker　by　four　standoffs　at　the　corner　of　the　board.　It　was　then　excited　by　sinusoidal　vibration　over　a　frequency　band　around　the　fundamental　frequency　of　the　test　vehicle　and　tested　until　the　components　failed.　For　all　failed　solder　joints,　metallurgical　cross-sections　were　examined　to　identify　the　failure　mechanism　and　locations.　Finally,　the　characteristic　life　of　the　PBGA　assemblies　was　obtained　using　Weibull　analysis　and　the　typical　vibration　fatigue　failure　modes　are　shown　in　this　paper.　©　2016　IEEE.