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作者:

Tang, Tao (Tang, Tao.) | An, Tong (An, Tong.) | Qin, Fei (Qin, Fei.) (学者:秦飞)

收录:

EI Scopus

摘要:

In the plastic ball grid array package (PBGA) assembly, there are many solder balls and copper pads. The whole packaging varies a lot in size. This multi-scale structure brings difficulties in building the finite element model. The paper refers a method to avoid difficulties by replacing the unconcern copper pad/solder mask layer with a homogenous material layer. The finite element method (FEM) is used to prove simplification model's accuracy. © 2016 IEEE.

关键词:

Ball grid arrays Copper Electronics packaging Finite element method Packaging

作者机构:

  • [ 1 ] [Tang, Tao]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China

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年份: 2016

页码: 1226-1229

语种: 英文

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