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作者:

Li, Huaicheng (Li, Huaicheng.) | An, Tong (An, Tong.) | Bie, Xiaorui (Bie, Xiaorui.) | Shi, Ge (Shi, Ge.) | Qin, Fei (Qin, Fei.) (学者:秦飞)

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摘要:

Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify the failure mechanism and locations of solder joints. Finite element analysis with quarter model was implemented to obtain the strain and stress of solder joints. Furthermore, viscoplastic Anand's model was used to describe the constitutive equation of Sn63Pb37 solder. The life prediction model was established based on Engelmaier's model at last. © 2016 IEEE.

关键词:

Ball grid arrays Binary alloys Electronics packaging Failure (mechanical) Finite element method Lead alloys Reliability analysis Soldered joints Thermal cycling Thermal fatigue Tin alloys Weibull distribution

作者机构:

  • [ 1 ] [Li, Huaicheng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
  • [ 2 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
  • [ 3 ] [Bie, Xiaorui]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
  • [ 4 ] [Shi, Ge]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
  • [ 5 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China

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年份: 2016

页码: 1104-1107

语种: 英文

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SCOPUS被引频次: 6

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