Thermal analysis and thermal optimization of through silicon via in 3D IC - 文章详情页

作者：

Fu, Jingyan (Fu, Jingyan.) | Hou, Ligang (Hou, Ligang.) | Lu, Bo (Lu, Bo.) | Wang, Jinhui (Wang, Jinhui.)

收录：

EI Scopus

摘要：

The　study　on　thermal　problem　of　through　silicon　via　has　become　an　important　part　of　the　three　dimensional　integrated　circuit.　This　paper　proposes　some　thermal　aware　optimization　measures　of　TSV　to　optimize　thermal　performance　of　3D　IC.　Thermal　performance　simulations　on　different　TSV　distribution,　different　TSV　structure　parameter　and　different　TSV　cluster　are　done　respectively.　Through　the　simulation　and　analysis,　qualitative,　quantitative　results　and　thermal　optimization　measures　are　presented.　According　to　the　result,　optimization　could　be　done　in　EDA　software.　©　2014　IEEE.

关键词：

Electronics packaging Integrated circuit interconnects Silicon Thermoanalysis Three dimensional integrated circuits Timing circuits

作者机构：

[ 1 ] [Fu, Jingyan]Beijing University of Technology, Beijing; 100124, China
[ 2 ] [Hou, Ligang]Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Lu, Bo]Beijing University of Technology, Beijing; 100124, China
[ 4 ] [Wang, Jinhui]Beijing University of Technology, Beijing; 100124, China

通讯作者信息：

[hou, ligang]beijing university of technology, beijing; 100124, china

电子邮件地址：

houligang@bjut.edu.cn

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