The　growth　behavior　of　intermetallic　compound　(IMC)　in　single　crystal　Sn3.0Ag0.5Cu　(SAC305)　and　Sn3.0Ag3.0Bi3.0In　(SABI333)　ball　grid　array　solder　joints　with　Au/Ni/Cu　pads　under　10(4)A/cm(2)　current　stressing　was　investigated.　Characterization　by　scanning　electron　microscopy　and　electron　backscattered　diffraction　mapping　were　utilized　to　identify　the　microstructure　and　crystal　orientation　of　solder　joints.　The　AuSn4　IMC　particles　in　the　SAC305　solder　matrix　were　formed　along　the　electron　flow　direction　and　c-axis　direction　of　Sn.　On　the　other　hand,　it　was　observed　that　the　Au(Sn-0.83,　In-0.17)(4)　IMC　particles　generated　in　SABI333　solder　matrix　decomposed　from　needle-like　morphology　into　small　pieces　of　Au(Sn-0.23,　In-0.77)(2)　during　current　stressing.　This　phenomenon　depends　on　the　different　diffusion　rate　and　opposite　migration　direction　of　Sn　and　In　atoms,　which　have　different　driving　forces.　Moreover,　the　results　showed　that　the　growth　behavior　of　IMC　particles　in　SAC305　solder　joints　was　significantly　dependent　on　the　c-axis　direction　of　Sn,　while　that　of　IMCs　in　SABI333　was　almost　maintained　without　polarization　effect.　This　study　indicated　that　SABI333　solder　joints　under　EM　service　could　exhibit　a　better　performance　than　that　of　SAC305　solder　joints.