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Failure behaviors of Sn-0.3Ag-0.7Cu solder joint under creep and current stressing

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作者:

Qiao, Lei (Qiao, Lei.) | Zuo, Yong (Zuo, Yong.) | Ma, Limin (Ma, Limin.) | 展开

收录:

EI Scopus

摘要:

The reliability issues such as creep, electromigration (EM), and thermal fatigue of solder joints in real service condition have gained much attention due to the rapid development of electronic devices towards multi-function, miniaturizing and portable tendency. There are many studies focusing on microstructure changes of solder joints under the single condition of creep, EM, or thermal fatigue. However, few studies focus on the coupling effect(s) of the above mentioned impact factors during the failure process of a solder joint. In this study, Sn-0.3Ag-0.7Cu which has much lower cost than Sn-3.0Ag-0.5Cu under the coupling stressing of EM and creep were investigated. The in-situ microstructure and resistance of the solder joints were observed and measured during the failure process. The results indicated that the lifetime, the fracture location, and the fracture mode of solder joint were significantly changed by the coupling effect(s) of creep and EM. © 2014 IEEE.

关键词:

Soldered joints Microstructure Silver alloys Ternary alloys Creep Copper alloys Current density Thermal fatigue Tin alloys Lead-free solders Failure (mechanical) Electronics packaging

作者机构:

  • [ 1 ] [Qiao, Lei]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
  • [ 2 ] [Zuo, Yong]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
  • [ 3 ] [Ma, Limin]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
  • [ 4 ] [Shu, Yutian]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
  • [ 5 ] [Guo, Fu]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China

通讯作者信息:

  • [qiao, lei]college of materials science and engineering, beijing university of technology, beijing, china

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年份: 2014

页码: 902-906

语种: 英文

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SCOPUS被引频次: 3

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