Simplified empirical formula on TSV thermal analysis for 3D IC EDA - 文章详情页

作者：

Lu, Bo (Lu, Bo.) | Hou, Ligang (Hou, Ligang.) | Fu, Jingyan (Fu, Jingyan.) | Wang, Jinhui (Wang, Jinhui.)

收录：

EI Scopus

摘要：

In　this　paper,　based　on　the　formulas　of　the　classic　theory　of　heat　conduction,　proposed　a　temperature　distribution　formula　in　the　three-dimensional　space,　which　can　effectively　and　accurately　calculated　the　temperature　value　at　any　coordinate-point　within　the　TSV(Through　Silicon　Via)　model.　By　simulating　the　behavior　of　heat　conduction　and　analyzing　temperature　data,　this　paper　proposed　the　simplified　empirical　formula　of　temperature　distribution　for　analyzing　in　3D　IC,　and　compared　the　calculated　value　with　the　simulation　value　to　validate.　These　results　will　be　easy　to　estimate　the　range　of　temperature　change　for　EDA　toll.　©　2014　IEEE.

关键词：

Electronics packaging Heat conduction Temperature distribution Thermoanalysis Three dimensional integrated circuits Timing circuits

作者机构：

[ 1 ] [Lu, Bo]Integrated Circuits and System Integration of Sciences, Beijing University of Technology, Beijing; 100124, China
[ 2 ] [Hou, Ligang]Integrated Circuits and System Integration of Sciences, Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Fu, Jingyan]Integrated Circuits and System Integration of Sciences, Beijing University of Technology, Beijing; 100124, China
[ 4 ] [Wang, Jinhui]Integrated Circuits and System Integration of Sciences, Beijing University of Technology, Beijing; 100124, China

通讯作者信息：

[hou, ligang]integrated circuits and system integration of sciences, beijing university of technology, beijing; 100124, china

电子邮件地址：

houligang@bjut.edu.cn

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