Characterization of thermal and curing behaviors of epoxy molding compounds - 文章详情页

作者：

Shen, Huiqiang (Shen, Huiqiang.) | Qin, Fei (Qin, Fei.) (学者：秦飞) | Xia, Guofeng (Xia, Guofeng.) | Bie, Xiaorui (Bie, Xiaorui.)

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EI Scopus

摘要：

In　this　paper,　both　isothermal　and　dynamic　differential　scanning　calorimetry　(DSC)　are　employed　to　characterize　the　thermal　properties　of　two　commercial　epoxy　molding　compounds　designated　as　EMC-A　and　EMC-B　respectively.　In　dynamic　curing,　the　heat　flow　of　uncured　powder　samples　weighting　10±0.5　mg　are　measured　at　the　heating　rates　of　5,　10　and　15　°C　/min　from　room　temperature　to　220　°C.　The　isothermal　curing　tests　are　performed　under　the　constant　temperatures　of　130,　140　and　150　°C　for　30　min.　The　experimental　results　show　that　compared　with　EMC-B,　EMC-A　has　smaller　average　curing　reaction　enthalpy　and　activation　energy　showing　a　better　moldability.　The　parameters　of　autocatalytic　Kamal　equation　for　these　two　EMCs　are　obtained　by　the　isothermal　curing　tests　and　the　curing　kinetic　model　exhibits　good　agreement　with　the　experimental　data　generally.　©　2014　IEEE.

关键词：

Sheet molding compounds Electromagnetic compatibility Activation energy Isotherms Molding Differential scanning calorimetry Electronics packaging Thermodynamic properties Curing

作者机构：

[ 1 ] [Shen, Huiqiang]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
[ 2 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
[ 3 ] [Xia, Guofeng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
[ 4 ] [Bie, Xiaorui]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China

通讯作者信息：

[shen, huiqiang]college of mechanical engineering and applied electronics technology, beijing university of technology, beijing, china

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