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[会议论文]

Multiple healing fatigue damage by laser shock peening for copper thin film

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Author:

Jin, Jia (Jin, Jia.) | Shang, De-Guang (Shang, De-Guang.) (Scholars:尚德广) | Liu, Xiao-Dong (Liu, Xiao-Dong.) | Unfold

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Abstract:

Multiple healing fatigue damage for polycrystal copper film was investigated by laser shock peening (LSP). The damaged specimens were healed several times under the optimal laser parameters. The relationship among the fatigue life, healing times and the damage degree were investigated. The experimental results showed that the multiple heal based on LSP can maximize fatigue life of the damaged specimens under the definite optimal condition with the obtained at damage degree of 0.4 and healing times of 3, in which nearly 4.6 times increase in residual fatigue life for the damaged specimens, and 7.8 times increase in the accumulated fatigue life. © (2013) Trans Tech Publications, Switzerland.

Keyword:

Electronics engineering Information technology Fatigue damage Optimization

Author Community:

  • [ 1 ] [Jin, Jia]Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, Beijing 100124, China
  • [ 2 ] [Shang, De-Guang]Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, Beijing 100124, China
  • [ 3 ] [Liu, Xiao-Dong]Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, Beijing 100124, China
  • [ 4 ] [Zhang, Li-Hong]Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, Beijing 100124, China
  • [ 5 ] [Guo, Yu-Bo]Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, Beijing 100124, China
  • [ 6 ] [Chen, Tao]Beijing University of Technology, Institute of Laser Engineering, Beijing 100124, China

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ISSN: 1022-6680

Year: 2013

Volume: 760-762

Page: 413-416

Language: English

Cited Count:

WoS CC Cited Count: 0

30 Days PV: 1

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