Non-destructive testing for defects in electronic package based on Infrared Thermography - 文章详情页

作者：

Liu, Chengyan (Liu, Chengyan.) | Qin, Fei (Qin, Fei.) (学者：秦飞) | Ban, Zhaowei (Ban, Zhaowei.)

收录：

EI Scopus

摘要：

Defects　such　as　interfacial　delaminations　degrade　the　yield　rate　and　reliability　of　the　device.　It＇s　important　to　find　and　evaluate　these　defects　on　time.　Infrared　Thermography　is　proved　to　be　a　valuable　tool　for　non-destructive　testing　of　materials.　In　this　paper　the　relationship　between　the　thermal　characteristics　of　the　sample　surface　and　the　defect　feature　parameters　is　investigated　using　Infrared　Thermography;　while　an　approach　to　quantitatively　evaluate　the　defect　is　proposed.　©　2013　IEEE.

关键词：

Bridge decks Thermography (imaging) Electronics packaging Packaging Nondestructive examination

作者机构：

[ 1 ] [Liu, Chengyan]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
[ 2 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China
[ 3 ] [Ban, Zhaowei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, China

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