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Author:

Xia, Guofeng (Xia, Guofeng.) | Qin, Fei (Qin, Fei.) (Scholars:秦飞) | Chen, Si (Chen, Si.) | An, Tong (An, Tong.)

Indexed by:

EI Scopus

Abstract:

The thermal fatigue reliability of solder bumps in TSV interposer package is analyzed by finite element method. The 3D finite element model of TSV interposer package is established in ANSYS software. Anand constitutive model is adopted to describe the viscoplastic behavior of Sn3.0Ag0.5Cu lead-free solder bumps. The influences of material properties and structural geometries on thermal fatigue reliability are evaluated by Taguchi method. The optimized factor combination design for promoting thermal fatigue reliability is obtained and validated by finite element analysis. The finite element modeling results show that the critical solder bump is located at the corner of solder bump array. Both the maximum von Mises stress and accumulated nonlinear strain energy density are located at the top layer elements of the critical solder bump. It is found that the material properties of underfill have the most important influence on thermal fatigue reliability of solder bumps. The higher Modulus and lower CTE improves the thermal fatigue life greatly. It is validated by finite element analysis that the optimized factor combination design can successfully improve the thermal fatigue reliability of solder bumps. © 2013 IEEE.

Keyword:

Three dimensional integrated circuits Silver alloys Strain energy Ternary alloys Finite element method Lead-free solders Thermal fatigue Electronics packaging Soldering Copper alloys Taguchi methods Soldered joints Tin alloys Flip chip devices Factor analysis Reliability analysis Packaging

Author Community:

  • [ 1 ] [Xia, Guofeng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Chen, Si]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 4 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

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Year: 2013

Page: 517-520

Language: English

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 3

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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