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Tensile specimens with a Cu/IMC/solder/IMC/Cu structure were prepared, and were treated by 0h, 72h, 168h, 288h, 500h, 1000h isothermal aging processing at 150°C. Quasi-static tensile tests were conducted on the micro-tester Instron5948, Fracture analysis of fractured specimens was conducted by optical microscopy and scanning electron microscopy. Two fracture modes were found, and the fracturing surface tends to be flat with the aging time increases. © 2013 IEEE.
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年份： 2013
页码： 861-864
语种： 英文
