Development of Sn-Bi systems lead-free solder paste - 文章详情页

作者：

收录：

EI Scopus

摘要：

The　contents　of　solvent,　rosin　and　activator　were　adjusted　to　obtain　the　most　appropriate　proportion　of　the　flux　for　Sn-Bi　based　lead　free　solder　material　by　a　series　of　orthogonal　experiments.　Compared　with　some　commercial　Sn-Bi　based　solder　pastes,　some　tests　about　the　solder　paste,　such　as　solder　ball　test,　wettability　test　and　slump　test　had　been　carried　on.　It　was　found　that　the　self-made　Sn-Bi　based　solder　paste　had　an　excellent　performance.　The　welding　spots　had　good　appearance;　the　residues　solidified　well.　The　effect　of　the　solder　powder　ratio　on　rheological　and　printing　behavior　had　been　studied.　When　the　mass　ratio　was　12:88wt%,　the　best　rheological　and　printing　properties　of　solder　paste　could　be　obtained.　©　2013　IEEE.

关键词：

Binary alloys Bismuth alloys Electronics packaging Fluxes Lead-free solders Soldering Temperature Tin alloys Wetting

作者机构：

[ 1 ] [Li, Kangning]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
[ 2 ] [Lei, Yongping]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
[ 3 ] [Lin, Jian]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
[ 4 ] [Liu, Baoquan]Yunnan Tin Material Co., Ltd., Kunming, 650217, Yunnan, China
[ 5 ] [Bai, Hailong]Yunnan Tin Material Co., Ltd., Kunming, 650217, Yunnan, China
[ 6 ] [Qin, Junhu]Yunnan Tin Material Co., Ltd., Kunming, 650217, Yunnan, China

通讯作者信息：

电子邮件地址：

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至