This　paper　presents　the　morphology　evolution　of　the　interfacial　intermetallic　compound　(IMC)　in　Cu/Sn-58Bi/Cu　solder　joint　during　current　stressing　and　loading　temperatures.　The　IMC　growth　kinetics　and　Bi　migration　towards　the　anode　side　was　analyzed　and　discussed.　One　dimensional　semicircular　sectioned　solder　joint　was　fabricated　and　used　to　conduct　the　electromigration　(EM)　experiment,　effectively　eliminated　the　thermomigration　effect　induced　by　Joule　heating　accumulation.　Results　indicated　that　the　solder　matrix　was　melted　due　to　the　combined　effect　of　electromigration　force　and　high　temperature.　After　cutting　off　the　circuit,　huge　valleys　were　found　in　the　solder　joints.　Furthermore,　partial　bulk　solder　extended　upon　the　Cu　substrates.　For　further　detecting　the　microstructural　evolution　of　the　solder　matrix,　the　tested　sample　was　polished　to　reveal　the　interior　microstructure.　It　can　be　noted　that　the　eutectic　microstructure　coarsened　slightly,　but　remained　the　original　uniform　distribution.　Most　important,　the　IMC　layer　formed　at　the　anode　interface　and　cathode　interface　displayed　different　thickness.　To　be　precise,　the　IMC　layer　thickness　formed　at　the　cathode　interface　was　larger　than　that　of　formed　at　the　anode　interface,　which　was　contradictory　with　the　traditional　theory　of　EM　effect　on　IMC　growth　in　SnAgCu　or　SnAg　solder　joints.　By　calculation,　the　cathodic　scallop-type　IMC　thickness　can　reach　34.3μm,　however,　merely　9.7μm-thick　IMC　layer　was　found　at　the　anode　interface.　It　should　be　noticed　that　a　uniform　7.5μm-thick　Bi　layer　was　aggregated　between　the　IMC　layer　and　the　solder　matrix　at　the　anode　interface.　The　diffusion　and　migration　path　of　the　Sn　atoms　to　the　anode　interface　was　blocked　because　of　the　compact　Bi　layer　formation,　which　reduced　the　actual　Sn　reacted　with　Cu　to　form　IMC.　Accordingly,　the　growth　rate　of　the　IMC　layer　decreased,　leading　to　the　abnormal　IMC　growth　at　the　interfaces.　©　2013　IEEE.