With　the　development　of　very　large　scale　integration,　the　chip　heat　dissipation　is　a　problem　that　needs　to　be　solved　urgently.　Vapor　compression　refrigeration　system　is　a　valid　method　to　cool　the　electric　chip.　However,　a　particular　challenge　is　to　make　a　small　and　efficient　gas　compressor.　In　this　paper,　a　mini-type　single　screw　compressor　was　manufactured　in　Beijing　University　of　Technology　and　a　corresponding　performance　test　system　was　set　up.　Experimental　results　show　that　the　heat　created　by　the　single　screw　compressor　is　higher,　which　led　to　an　extreme　high　exhaust　temperature.　An　effective　solution　is　to　introduce　the　low　temperature　refrigerant　from　the　condenser　to　the　compressor　directly　to　cool　down　the　compressor.　Based　on　this　procedure,　the　compressor　performance　was　measured　experimentally.　It　was　found　that　the　condensing　temperature,　compressor　rotation　speed　and　refrigerant　charge　can　affect　the　compressor　performance　noticeably　and　every　affective　factor　has　an　optimal　value.　According　to　the　optimal　results,　the　compressor　refrigerating　capacity　of　2.03　kW　and　system　coefficient　of　performance　(COP)　of　2.24　was　achieved　at　the　evaporating　temperature　of　5　°C　and　condensing　temperature　of　32　°C.　Those　results　can　be　a　baseline　for　the　further　performance　enhancement　of　the　single　screw　compressor　and　can　be　a　valid　method　for　the　cooling　of　large　scale　integration.　Copyright　©　2012　by　ASME.