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摘要:
For the optically pumped semiconductor disk lasers, the thermal problem is the key to obtain the high out power. To solve this problem, we simulated the heat distribution of the gain chip by finite-element analysis method to discover the heat spread affected by the thickness of the substrate and found the outstanding heat spread result of the diamond chip.
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年份: 2012
页码: 231-233
语种: 英文
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