Thermoelectric　materials　are　widely　used　as　thermoelectric　cooler　in　electronic　devices.　Bismuth　telluride　is　considered　as　one　of　the　candidates　because　of　the　good　performance　in　room　temperature.　Besides,　Sn-Bi　solder　paste　has　been　employed　to　connect　the　electronic　component　and　thermoelectric　materials　due　to　its　low　melting　point.　However,　Te　consumed　rapidly　because　of　the　reaction　between　solder　and　bismuth　telluride.　The　fast　formation　of　intermetallic　compound　degraded　the　reliability　of　the　joints.　Thus,　a　Ni　resistant　layer　plated　by　vacuum　evaporation　was　introduced　in　current　study　to　obstruct　the　formation　of　SnTe　intermetallic　compound　and　improve　the　mechanical　stability　and　electrical　properties　of　the　joints.　The　results　revealed　that　the　resistance　of　p-　or　n-TE/SBA/Cu　joints　was　stable　and　the　shear　strength　of　both　them　decreased　during　isothermal　aging.　There　was　no　obvious　SnTe　intermetallic　compound　formed　when　introducing　Ni　layer.　However,　the　p-　or　n-TE/Ni/SBA/Cu　joints　generated　some　defects　such　as　cracks　which　grew　larger　during　isothermal　aging.　With　the　increase　of　aging　time,　the　resistance　and　shear　strength　increased　and　decreased,　respectively.　Besides,　no　obvious　effect　of　introducing　Ni　layer　between　solder　and　thermoelectric　materials　on　the　mechanical　property　during　aging　process.　It　was　suggested　that　the　bonding　strength　of　Ni　layer　may　not　strong　enough　through　the　vacuum　evaporation　method.　©　2012　IEEE.