Signal integrity aware TSV positioning - 文章详情页

作者：

Hou, Ligang (Hou, Ligang.) | Bai, Shu (Bai, Shu.) | Wang, Jinhui (Wang, Jinhui.) | Peng, Xiaohong (Peng, Xiaohong.) | Geng, Shuqin (Geng, Shuqin.)

收录：

EI Scopus

摘要：

In　this　paper,　a　signal　integrity　aware　TSV　positioning　method　(SITP)　is　introduced.　Grounded　TSV　proved　to　help　eliminating　TSV-to-TSV　coupling.　A　trench　based　3D　IC　placement　method　is　developed,　transforming　2D　placement　into　3D　placement　and　perform　signal　TSV　placement　with　flexible　grounded　TSV　Insertion.　IBM　placement　benchmark　is　used　for　original　2D　placement.　By　evaluating　wire-length　and　runtime,　SITP　automatically　achieve　high　performance　3D　IC　placement　with　considerable　TSV-TSV　interference　elimination.　©　2012　IEEE.

关键词：

Three dimensional integrated circuits Busbars Electromagnetic compatibility

作者机构：

[ 1 ] [Hou, Ligang]VLSI and System Lab., Beijing University of Technology, 425 Mailbox, No.100 PingLeYuan, Beijing, China
[ 2 ] [Bai, Shu]VLSI and System Lab., Beijing University of Technology, 425 Mailbox, No.100 PingLeYuan, Beijing, China
[ 3 ] [Wang, Jinhui]VLSI and System Lab., Beijing University of Technology, 425 Mailbox, No.100 PingLeYuan, Beijing, China
[ 4 ] [Peng, Xiaohong]VLSI and System Lab., Beijing University of Technology, 425 Mailbox, No.100 PingLeYuan, Beijing, China
[ 5 ] [Geng, Shuqin]VLSI and System Lab., Beijing University of Technology, 425 Mailbox, No.100 PingLeYuan, Beijing, China

通讯作者信息：

电子邮件地址：

houligang@bjut.edu.cn

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