Optimal thermal design of a high power package using the design of experiment (DOE) - 文章详情页

作者：

Gao, Cha (Gao, Cha.) | Qin, Fei (Qin, Fei.) (学者：秦飞) | Zhu, Wenhui (Zhu, Wenhui.) | Xia, Guofeng (Xia, Guofeng.) | Ma, Xiaobo (Ma, Xiaobo.)

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摘要：

Thermal　management　for　package　assembly,　especially　for　high　power　packages,　is　very　important　to　the　reliability　and　quality　of　electrical　products.　In　this　paper,　a　finite　element　approach　is　proposed　to　investigate　the　thermal　performance　of　TO252-5L(B)　package　attached　on　printed　circuit　board(PCB)　with　different　layers　and　sizes,　which　is　further　related　to　reliability　issue　of　this　type　of　IC　package.　©　2012　IEEE.

关键词：

Design of experiments Electronics packaging Finite element method Heat resistance Packaging Printed circuit boards

作者机构：

[ 1 ] [Gao, Cha]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
[ 2 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
[ 3 ] [Zhu, Wenhui]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
[ 4 ] [Zhu, Wenhui]Packaging Technology Research Institute, Tian Shui Hua Tian Technology CO., Ltd, Tian Shui Hua Tian, 741000, China
[ 5 ] [Xia, Guofeng]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
[ 6 ] [Ma, Xiaobo]Packaging Technology Research Institute, Tian Shui Hua Tian Technology CO., Ltd, Tian Shui Hua Tian, 741000, China

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