An equivalent model of TSV silicon interposer - 文章详情页

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The　silicon　layer　containing　through　silicon　vias　(TSVs)　is　considered　as　anisotropic　fiber　reinforced　composite　layer　with　different　longitudinal　and　transversal　properties.　An　analytical　approach　is　presented　to　estimate　the　effective　Young＇s　modulus,　Poisson＇s　ratio　and　coefficient　of　thermal　expansion　(CTE)　for　composite　layer.　It　shows　that　the　TSVs　have　no　significant　influence　on　the　deflection　of　silicon　layer,　and　the　model　ignoring　TSVs　is　capable　to　predict　enough　accurate　deflection　of　silicon　layer.　©　2012　IEEE.

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Three dimensional integrated circuits Elastic moduli Fiber reinforced plastics Thermal expansion Silicon Electronics packaging

作者机构：

[ 1 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
[ 2 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
[ 3 ] [Wu, Wei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
[ 4 ] [Yu, Daquan]Institute of Microelectronics of Chinese Academy of Sciences, Beijing io0029, China
[ 5 ] [Wan, Lixi]Institute of Microelectronics of Chinese Academy of Sciences, Beijing io0029, China
[ 6 ] [Wang, Jun]Materials Science Department, Fudan University, Shanghai 200433, China

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