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Author:

Ma, Z. (Ma, Z..) | Belhenini, S. (Belhenini, S..) | Joly, D. (Joly, D..) | Chalon, F. (Chalon, F..) | Leroy, R. (Leroy, R..) | Ranganathan, N. (Ranganathan, N..) | Qin, F. (Qin, F..) (Scholars:秦飞) | Doisseul, F. (Doisseul, F..)

Indexed by:

EI Scopus

Abstract:

To secure the reliability of lead free solder is a critical problem for microelectronics packaging. The drop test is used to characterize the reliability of the soldered assemblies. Numerical simulation techniques are popularly used for such tests to reduce the cost. A proper working combination of the damage criterion and the numerical simulation to predict fatigue life is still an unsolved problem for the researchers. IMC layer generated during the solder bumping process between solder and under solder mask is known as a key aspect determining the failure of solder joint and cracks always initiate in this layer. In this work, the most fragile part in an electronic assembly is evaluated by FEM; nano impact tests are realized on IMC layer and on solder body. Tests prove that the IMC layer is the most fragile part and the crack initiation energy density in IMC layer as a damage criterion is proposed. Then this criterion is combined with the board level drop test simulation result to predict the number of drop necessary for the crack initiation in IMC layer and this number cannot be obtained directly during the drop test. © 2012 IEEE.

Keyword:

Drops Soldering Soldered joints Packaging Crack initiation Microelectronics Cracks Numerical models Flip chip devices Lead-free solders Electronics packaging

Author Community:

  • [ 1 ] [Ma, Z.]Laboratory Mechanical and Rheology, Tours University, 7 avenue Marcel, Dassault 37200, France
  • [ 2 ] [Belhenini, S.]Laboratory Mechanical and Rheology, Tours University, 7 avenue Marcel, Dassault 37200, France
  • [ 3 ] [Joly, D.]Laboratory Mechanical and Rheology, Tours University, 7 avenue Marcel, Dassault 37200, France
  • [ 4 ] [Chalon, F.]Laboratory Mechanical and Rheology, Tours University, 7 avenue Marcel, Dassault 37200, France
  • [ 5 ] [Leroy, R.]Laboratory Mechanical and Rheology, Tours University, 7 avenue Marcel, Dassault 37200, France
  • [ 6 ] [Ranganathan, N.]Laboratory Mechanical and Rheology, Tours University, 7 avenue Marcel, Dassault 37200, France
  • [ 7 ] [Qin, F.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 8 ] [Doisseul, F.]ST Microlecronics, 16 Rue Pierre et Marie Curie, 37100 Tours, France

Reprint Author's Address:

  • [ma, z.]laboratory mechanical and rheology, tours university, 7 avenue marcel, dassault 37200, france

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Source :

Year: 2012

Page: 1367-1371

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count: 1

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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