Flexible　copper　clad　laminate　(FCCL)　mainly　consists　of　conductive　material　(like　copper　foil)　and　insulated　basilemma　(such　as　PET).　It　is　widely　used　in　Flexible　Printed　Circuit　(FPC)　to　produce　various　electronic　products.　The　thickness　of　copper　differs　according　to　its　application.　In　this　paper,　the　FCCL　with　18um　copper　foil　plated　on　70um　polyester　film　is　used　to　prepare　the　design　patterns　without　any　damage　to　polyester　film　by　removing　surface　copper　film　selectively.　Because　the　melting　point　of　polyester　and　copper　varies　considerably,　it　is　difficult　to　remove　the　copper　directly　by　laser　ablation　without　harming　polyester　base.　This　paper　presents　the　test　results　of　using　laser　to　remove　copper　membrane　directly.　A　method　of　laser　irradiation　and　then　removing　copper　through　wet　etching　is　introduced　at　last　Better　design　of　micro　removing　copper　film　without　damaging　polyester　base　is　obtained.　©　2011　IEEE.