Copper-aluminum　powders　were　prepared　by　displacement　method　in　aqueous　system　at　40°C.　Composite　powder＇s　surface　topography　was　investigated　by　varying　the　addition　of　sodium　fluoride　(NaF).　It　was　noted　that　dense　and　uniform　copper　coating　was　obtained　when　the　mass　ratio　of　NaF　and　aluminum　powder　was　approximate　0.1.　The　mechanism　of　copper　coating　formation　was　discussed　in　detail.　The　deposition　process　was　summarized　to　four　stages,　including　initial　reaction　stage,　grid　formation　stage,　two-dimensional　coating　spread　stage　and　final　epitaxial　growth　stage.　©　2011　IEEE.