Morphology and nanoindentation properties of intermetallic compounds in solder joints - 文章详情页

作者：

Zhong, Weixu (Zhong, Weixu.) | Qin, Fei (Qin, Fei.) (学者：秦飞) | An, Tong (An, Tong.) | Liu, Chengyan (Liu, Chengyan.)

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EI Scopus

摘要：

The　growth　of　intermetallic　compounds　(IMC)　at　the　Sn3.0Ag0.5Cu/Cu　interface　is　investigated　under　aging　temperature　of　150　°C　and　aging　time　of　100,　300　and　500　hours.　The　relationship　between　the　thickness　of　the　IMC　and　aging　time　is　fitted　out,　and　the　growth　law　of　the　IMC　at　Sn3.0Ag0.5Cu/Cu　interface　under　isothermal　aging　condition　is　obtained.　Mechanical　properties　of　the　Cu6Sn5　and　Cu3Sn　are　obtained　by　a　G200　nanoindentation　tester.　It　indicates　that　with　the　Cu6Sn5　thickness　increases,　its　Young＇s　modulus　and　hardness　have　no　change.　The　Young＇s　modulus　of　Cu3Sn　is　greater　than　that　of　Cu　6Sn5,　but　the　hardness　of　Cu3Sn　is　lower　than　that　of　Cu6Sn5.　The　nanoindentation　experiments　of　the　Sn3.0Ag0.5Cu/Cu　interfacial　zone　show　that　the　hardness　of　Cu,　Cu3Sn,　Cu6Sn5　and　Sn3.0Ag0.5Cu　has　an　order　in　magnitude　of　Cu6Sn5　＞　Cu3Sn　＞　Cu　Sn3.0Ag0.5Cu.　©　2011　IEEE.

关键词：

Binary alloys Elastic moduli Electronics packaging Hardness Intermetallics Morphology Nanoindentation Packaging Silver alloys Ternary alloys Tin alloys

作者机构：

[ 1 ] [Zhong, Weixu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Liu, Chengyan]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

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