In　this　paper,　a　test　method　of　accelerated　stress　through　temperature　and　humidity　was　designed.　For　the　3DK10　NPN　transistors　of　package　with　and　without　painting,　the　life　test　was　continuous　for　115　hours　under　125°C　and　95%　humidity.　In　the　result,　the　parameters　of　all　transistors　are　not　obviously　changed,　at　the　same　time,　we　found　the　package　painting　is　strong　hygroscopic　which　has　a　large　effect　on　the　reliability　of　the　devices　in　high　humidity.　At　last,　we　compared　the　parameters　of　the　transistors　between　the　new　transistors　and　ones　in　storage　for　over　thirty　years,　the　result　was　described,　after　long-term　storage　the　output　characteristics　degrade,　the　gain　of　some　devices　decreases　and　the　gain　of　some　of　them　increases.　©　2011　IEEE.