A constitutive model for lead-free solders considering the damage effect at high strain rates - 文章详情页

作者：

Wang, Xuming (Wang, Xuming.) | Qin, Fei (Qin, Fei.) (学者：秦飞) | An, Tong (An, Tong.)

收录：

EI Scopus

摘要：

The　rate-dependent　Johnson-Cook　material　model　can　predict　the　stresses　and　strains　of　lead-free　solder　when　the　strain　rate　is　relatively　low　(600　s　-1).　At　higher　strain　rates　(1200　s-1　or　above),　the　stress-strain　curves　predicted　by　Johnson-Cook　model　do　not　agree　well　with　the　experimental　results　when　the　strain　exceeds　a　threshold　value.　In　this　paper,　the　damage　effect　is　considered　into　the　impact　process　of　lead-free　solder　specimens.　©　2011　IEEE.

关键词：

Elasticity Electronics packaging Lead-free solders Packaging Strain rate Stress-strain curves Structural design

作者机构：

[ 1 ] [Wang, Xuming]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Qin, Fei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
[ 3 ] [An, Tong]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

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