Design and thermal analysis of SiGe HBT with segmented emitter fingers and non-uniform segment spacing - 文章详情页

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A　novel　multi-finger　power　SiGe　heterojunction　bipolar　transistor　(HBT)　with　segmented　emitter　fingers　and　nonuniform　segment　spacing　was　proposed　to　improve　the　thermal　stability.　Thermal　simulation　for　a　ten-finger　power　SiGe　HBT　with　novel　structure　was　conducted　with　ANSYS　software.　Three-dimensional　temperature　distribution　on　emitter　fingers　was　obtained.　Compared　with　traditional　emitter　structure,　the　maximum　junction　temperature　of　novel　structure　reduce　significantly　from　427.465K　to　417.03K,　the　thermal　resistance　reduce　from　170K/W　to　156K/W,　temperature　distribution　were　significantly　improved.　Thermal　stability　was　effective　enhanced.　©　2010　IEEE.

关键词：

Temperature distribution Millimeter waves Thermodynamic stability Heterojunctions Si-Ge alloys Heterojunction bipolar transistors Thermoanalysis Computer software

作者机构：

[ 1 ] [Chen, Liang]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China
[ 2 ] [Zhang, Wan-Rong]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China
[ 3 ] [Jin, Dong-Yue]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China
[ 4 ] [Xiao, Ying]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China
[ 5 ] [Wang, Ren-Qing]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China
[ 6 ] [Hu, Ning]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China

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