Steady-state thermal simulation of ICS based on SKILL language and finite element method - 文章详情页

作者：

Bin, Zhang (Bin, Zhang.) | Shiwei, Feng (Shiwei, Feng.) (学者：冯士维) | Rong, Su (Rong, Su.) | Guangchen, Zhang (Guangchen, Zhang.)

收录：

EI Scopus

摘要：

In　this　paper,　a　new　method　which　combines　SKILL　language　with　finite　element　method　is　presented.　The　analysis　of　steady-state　thermal　simulation　of　analog　circuit　designed　by　Cadence　design　software　is　made　by　this　method.　Electronic　parameters　and　equivalent　thermal　resistances　of　devices　can　be　obtained　by　Cadence　circuit　simulation　software　and　finite　element　analysis　software-ANSYS.　Then　the　temperature　rise　of　the　device　in　circuit　can　be　calculated.　Combining　location　message　obtained　by　SKILL　program　with　the　temperature　rise　of　device,　temperature　distribution　graph　is　found.　Finally　the　result　is　verified　by　a　complete　ANSYS　analysis.　©　2010　IEEE.

关键词：

Circuit simulation Computer simulation languages Computer software Finite element method Heat resistance Integrated circuits Temperature distribution

作者机构：

[ 1 ] [Bin, Zhang]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 2 ] [Shiwei, Feng]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 3 ] [Rong, Su]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 4 ] [Guangchen, Zhang]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China

通讯作者信息：

电子邮件地址：

zhangbin1984925@yahoo.com.cn

查看成果更多字段

成果类型
所属机构

所有年份指定年份从至