Enhanced thermal measurements of high power LEDs by junction characteristic - 文章详情页

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EI Scopus

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The　measurements　of　junction　temperature　rise　and　thermal　resistance　of　power　LEDs　by　junction　characteristic　are　proposed　in　this　paper.　The　measured　thermal　resistance　is　corrected　by　the　light-absorbing　method.　It　is　also　proved　that　the　physical　meaning　of　the　electrical　average　temperature　rise　of　series　LED　array　system　is　the　arithmetic　mean　of　the　temperature　rise　of　all　sub-LEDs　in　the　system.　Therefore,　a　novel　method　to　extract　the　temperature　distribution　of　series　LED　systems　is　presented.　©　2010　IEEE.

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Light emitting diodes

作者机构：

[ 1 ] [Ge, Chenning]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 2 ] [Feng, Shiwei]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 3 ] [Zhang, Guangchen]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 4 ] [Ding, Kaikai]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 5 ] [Hu, Peifeng]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 6 ] [Deng, Haitao]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China

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