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作者:

Zhang, H. H. (Zhang, H. H..) | Liu, S. M. (Liu, S. M..) | Han, S. Y. (Han, S. Y..) | Fan, L. F. (Fan, L. F..) (学者:范立峰)

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EI Scopus SCIE

摘要:

Profiting from its bi-cover systems, i.e., the mathematical cover and the physical cover, the numerical manifold method (NMM) is superior in crack modeling. In this work, the NMM is further extended to study thermal shock fracture behavior of two-dimensional functionally graded materials (FGMs). The discontinuity of temperature and displacement fields across crack surface is naturally represented by the NMM, while the singularity of the heat fluxes and stresses at the crack tip is captured through the use of associated asymptotic terms in the NMM local functions. The temperatures are firstly obtained through transient heat transfer simulation and then stepwisely imported into the thermoelastic counterpart to compute the mechanical quantities. The thermal stress intensity factors (TSIFs) are obtained through the domain-independent interaction integral. For verification, several numerical examples with increasing complexity are tested and the NMM results match well with the available published solutions. Moreover, the influences of the material gradation of the FGMs and the crack geometries on the TSIFs are also revealed.

关键词:

Functionally graded materials Numerical manifold method Thermal shock crack Thermal stress intensity factors Transient temperature

作者机构:

  • [ 1 ] [Zhang, H. H.]Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
  • [ 2 ] [Liu, S. M.]Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
  • [ 3 ] [Han, S. Y.]Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
  • [ 4 ] [Fan, L. F.]Beijing Univ Technol, Coll Architecture & Civil Engn, Beijing 100084, Peoples R China

通讯作者信息:

  • 范立峰

    [Fan, L. F.]Beijing Univ Technol, Coll Architecture & Civil Engn, Beijing 100084, Peoples R China

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来源 :

ENGINEERING FRACTURE MECHANICS

ISSN: 0013-7944

年份: 2019

卷: 208

页码: 90-106

5 . 4 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:52

JCR分区:1

被引次数:

WoS核心集被引频次: 26

SCOPUS被引频次: 24

ESI高被引论文在榜: 0 展开所有

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