As　an　effective　and　feasible　method,　the　technology　of　non-uniform　emitter　finger　spacing　has　been　used　to　alleviate　the　thermal　effects　and　improve　the　uneven　temperature　profile　in　multi-finger　power　SiGe　HBTs.　However,　for　the　HBT　with　dozens　of　emitter　fingers,　designing　multiple　finger　spacing　values　becomes　trivial　and　time-consuming.　In　the　paper,　a　new　thermal　design　methodology　namely　Grouping　and　Adjusting　(GA)　method　is　proposed　to　shorten　design　time　of　non-uniform　spacing　values.　Taking　a　30-finger　HBT　for　example,　the　detailed　design　procedure　of　non-uniform　spacing　values　is　presented,　which　shows　that　the　peak　temperature　is　lowed　by　8.3K,　and　the　maximum　temperature　difference　is　improved　by　23.5%　when　compared　with　the　uniform　one.　Furthermore,　three　types　of　the　formulas　for　designing　the　spacing　values　are　proposed　to　meet　the　different　requirement　of　the　temperature　profile.　©　2010　IEEE.