Thermal analysis of ICS based on equivalent thermal resistance and skill language - 文章详情页

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EI Scopus

摘要：

The　thermal　analysis　of　ICs　has　been　studied　in　different　methods　for　years.　In　this　paper,　a　new　method　to　analyze　the　steady-state　temperature　distribution　of　integrated　circuit　is　presented.　According　to　equivalent　thermal　resistance　formula　obtaining　by　an　aid　tool　ANSYS　and　programming　idea,　the　temperature　distribution　graph　of　an　analog　integrated　circuit　is　obtained.　And　the　result　is　verified　by　a　complete　ANSYS　analysis.　©2009　IEEE.

关键词：

Analog integrated circuits Failure analysis Failure (mechanical) Temperature distribution Thermoanalysis

作者机构：

[ 1 ] [Zhang, Bin]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 2 ] [Su, Rong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 3 ] [Feng, Shiwei]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 4 ] [Zhang, Guangchen]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 5 ] [Guo, Chunsheng]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 6 ] [Liu, Yin]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
[ 7 ] [Ding, Kaikai]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China

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电子邮件地址：

shwfeng@bjut.edu.cn

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