Study on the chip-level thermal non-uniformity evaluation of semiconductor devices - 文章详情页

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摘要：

A　novel　method　is　proposed　to　evaluate　the　chip-level　thermal　non-uniformity　of　semiconductor　devices　by　electrical　transient　thermal　response　testing.　It　is　found　that　the　degree　of　integrated　chip　thermal　non-uniformity　could　be　determined　non-destructively　by　the　device　heating　response　curves.　©2009　IEEE.

关键词：

Integrated circuits Failure analysis Failure (mechanical)

作者机构：

[ 1 ] [Zhang, Guangchen]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 2 ] [Feng, Shiwei]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 3 ] [Zhang, Yuezong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 4 ] [Su, Rong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 5 ] [Xie, Xuesong]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China
[ 6 ] [Ge, Chenning]School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, China

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电子邮件地址：

gchzhang@emails.bjut.edu.cn

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